Wire bonding in microelectronics /
by Harman, George G.
Additional authors:
Harman, George G.
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Reliability and yield problems of wire bonding in microelectronics.
Edition statement:3rd ed.
Published by :
McGraw-Hill,
(New York :)
Physical details: xx, 426 p. : ill. ; 24 cm.
ISBN:9780071476232.
Subject(s):
Engineering
|
Electronics
|
Electronic packaging
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Defects.
|
Semiconductors
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Failures.
Year: 2010
| Item type | Current location | Call number | Status | Date due | Barcode |
|---|---|---|---|---|---|
Books
|
University of Sargodha-Central Library | 621.381 HAW (Browse shelf) | Checked out | 06/19/2019 | 96504 |
Rev. ed. of: Reliability and yield problems of wire bonding in microelectronics. 1989.
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