| 000 -LEADER |
|---|
| fixed length control field |
01162pam a2200325 a 4500 |
| 001 - CONTROL NUMBER |
|---|
| control field |
16196039 |
| 003 - CONTROL NUMBER IDENTIFIER |
|---|
| control field |
OSt |
| 005 - DATE AND TIME OF LATEST TRANSACTION |
|---|
| control field |
20190725123309.0 |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION |
|---|
| fixed length control field |
100420s2010 nyua b 001 0 eng |
| 010 ## - LIBRARY OF CONGRESS CONTROL NUMBER |
|---|
| LC control number |
2010287045 |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER |
|---|
| International Standard Book Number |
9780071476232 |
| 040 ## - CATALOGING SOURCE |
|---|
| Original cataloging agency |
DLC |
| Transcribing agency |
DLC |
| Modifying agency |
DLC |
| 050 00 - LIBRARY OF CONGRESS CALL NUMBER |
|---|
| Classification number |
TK7836 |
| Item number |
.H366 2010 |
| 082 ## - DEWEY DECIMAL CLASSIFICATION NUMBER |
|---|
| Edition number |
21 |
| Classification number |
621.381 |
| Item number |
HAW |
| 100 1# - MAIN ENTRY--PERSONAL NAME |
|---|
| Personal name |
Harman, George G. |
| 245 10 - TITLE STATEMENT |
|---|
| Title |
Wire bonding in microelectronics / |
| 250 ## - EDITION STATEMENT |
|---|
| Edition statement |
3rd ed. |
| 260 ## - PUBLICATION, DISTRIBUTION, ETC. (IMPRINT) |
|---|
| Place of publication, distribution, etc |
New York : |
| Name of publisher, distributor, etc |
McGraw-Hill, |
| Date of publication, distribution, etc |
c2010. |
| 300 ## - PHYSICAL DESCRIPTION |
|---|
| Extent |
xx, 426 p. : |
| Other physical details |
ill. ; |
| Dimensions |
24 cm. |
| 500 ## - GENERAL NOTE |
|---|
| General note |
Rev. ed. of: Reliability and yield problems of wire bonding in microelectronics. 1989. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
|---|
| Topical term or geographic name as entry element |
Engineering |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
|---|
| General subdivision |
Electronics |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
|---|
| Topical term or geographic name as entry element |
Electronic packaging |
| General subdivision |
Defects. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
|---|
| Topical term or geographic name as entry element |
Semiconductors |
| General subdivision |
Failures. |
| 700 1# - ADDED ENTRY--PERSONAL NAME |
|---|
| Personal name |
Harman, George G. |
| Title of a work |
Reliability and yield problems of wire bonding in microelectronics. |
| 906 ## - LOCAL DATA ELEMENT F, LDF (RLIN) |
|---|
| a |
7 |
| b |
cbc |
| c |
origcop |
| d |
2 |
| e |
ocip |
| f |
20 |
| g |
y-gencatlg |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) |
|---|
| Source of classification or shelving scheme |
|
| Koha item type |
Books |