Harman, George G.
Wire bonding in microelectronics / - 3rd ed. - New York : McGraw-Hill, c2010. - xx, 426 p. : ill. ; 24 cm.
Rev. ed. of: Reliability and yield problems of wire bonding in microelectronics. 1989.
9780071476232
2010287045
Engineering-- Electronics
Electronic packaging--Defects.
Semiconductors--Failures.
TK7836 / .H366 2010
621.381 / HAW
Wire bonding in microelectronics / - 3rd ed. - New York : McGraw-Hill, c2010. - xx, 426 p. : ill. ; 24 cm.
Rev. ed. of: Reliability and yield problems of wire bonding in microelectronics. 1989.
9780071476232
2010287045
Engineering-- Electronics
Electronic packaging--Defects.
Semiconductors--Failures.
TK7836 / .H366 2010
621.381 / HAW